SILVER CONDUCTVE EPOXY H22 1oz

Hazard Warning: F, I

EPO-TEK® Conductive Silver-Epoxy

Two Types: 
H-22 EPO-TEK®- silver resin paste / liquid hardener: (100:4.5 ratio) 
H20E EPO-TEK®- silver resin paste / silver resin paste hardener: (1:1 ratio) 

General Properties 
100% solids, two component silver filled epoxy with a soft, smooth, thixotropic (becoming less viscous when stirred or shaken) consistency designed specifically for chip bonding in microelectronic and optoelectronic applications.

Excellent handling characteristics, extremely long pot life at room temperature for this electrically conductive silver adhesive. High speed epoxy chip bonding systems are suitable for very fast cures, such as fast circuit repairs. Can be screen printed, machine dispersed or stamped and can withstand wire bonding temperatures in the range of 300 - 400°C.

Silver Conductive Epoxy, H-22 EPO-TEK®

Two component, silver-filled epoxy system, consisting of a silver resin paste and a liquid hardener (100:4.5). It is a free flowing paste, 100% solids system characterized by outstanding high temperature properties as well as excellent solvent, chemical and moisture resistance. It has a long pot life and is fast curing at relatively low temperatures. Containing no solvents or thinners; it will not outgas. It can be applied by brush, spatula or hypodermic needle. H-22 can be useful for small angle cleavage in material science and semi-conductor applications. EPO-TEK® silver content is 60% by weight of composition.

NASA approved – passes NASA low outgassing standard ASTM E595 with proper cure. Ref: http://outgassing.nasa.gov.

Note: Mixing ratio for this product is 100 parts silver resin paste to 4.5 parts liquid hardener. 

Cure Schedule (minimum bond temperature/time) 
150°C .........5 minutes 
120°C .......10 minutes 
100°C .......20 minutes 
  80°C .......45 minutes 

Properties:

• Color: silver
• Consistency: smooth, flowing paste
• Sheet resistance 2 ohms/sq/mil
• Refrigeration: not required.
• Higher Viscosity (20,000cps)