PELCO® Precision Lapping Fixtures

Precision lapping, polishing, and thinning for all sample types


Precision hand lapping fixtures allow for the preparation of planar, parallel, and highly polished surfaces on metallographic specimens, single-crystal wafers, electronic materials, glasses, rock samples, or other materials.

Lapping processes are also used to generate highly parallel, smooth faces, and to thin specimens to a precise target thickness. They may aid greatly in avoiding rounding or overpolishing when a hard material is embedded in a softer matrix, such as in epoxy-embedded samples. This is particularly useful in hand polishing semiconductors, optical components, and for thinning TEM specimens before finishing via dimple polishing.

PELCO® lapping fixtures allow for lapping of samples from <1/8" (3mm) to 1" (25mm) in diameter, and up to 1/2" (13 mm) thick. Micrometer and shim-controlled versions are available. Fixtures are equipped with tungsten carbide feet, which are highly resistant to wear from the lapping process.


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