Precision hand lapping fixtures allow for the preparation of planar, parallel, and highly polished surfaces on metallographic specimens, single-crystal wafers, electronic materials, glasses, rock samples, or other materials.

Lapping processes are also used to generate highly parallel, smooth faces, and to thin specimens to a precise target thickness. They may aid greatly in avoiding rounding or overpolishing when a hard material is embedded in a softer matrix, such as in epoxy-embedded samples. This is particularly useful in hand polishing semiconductors, optical components, and for thinning TEM specimens before finishing via dimple polishing.

PELCO® lapping fixtures allow for lapping of samples from <1/8" (3mm) to 1" (25mm) in diameter, and up to 1/2" (13 mm) thick. Micrometer and shim-controlled versions are available. Fixtures are equipped with tungsten carbide feet, which are highly resistant to wear from the lapping process.